Abstract—With rapid growth of electronic technology, devices are capable of processing more data within a stipulated period of time. Example of such high-density applications are the internet/intranet, networking, data centres and Voice over IP has resulted in the rapid rise of the super slim 1- User rack-mounted chassis solution. The reliability of electronic components is affected critically by the temperature at which they operates. The continuous increase of power densities in electronic packages and the simultaneous drive to reduce the size and weight of electronic products have led to an increased importance on thermal management issues in electronic industry. Cooling of electronic components is enhanced by the use of heat sinks. The present analysis deals with better thermal management of 1-User server with optimum design of heat sink, enhancement of air flow and heat sink with embedded heat pipe. Heat transfer and air flow simulations are carried by Icepack, commercial CFD software.

Index Terms—Computational Fluid Dynamics, Heat Transfer Analysis, 1-User server

Cite: G Venkata Subbaiah, Y Suresh Reddy, and K Vijay Kumar Reddy, "Heat Transfer Analysis of 1-User Server through CFD," International Journal of Mechanical Engineering and Robotics Research, Vol.2 No.3, pp. 350-356, July 2013.