Abstract—The justification of the correctness of the selected regimes for silicate glass, leucosapphire and diamond sawing based on the finite element modeling of the friction node deformation is given. The natural oscillation frequencies for the shaft with the saw disk and the forms of stability loss are observed. The analysis of the temperature fields recorded during the sawing process is performed for the hardest sample (diamond). The nature of the destruction for the side surfaces of the sawn pieces is analyzed.